solder-removal

  1. Finetech Gmbh && Co. Kg

    BGA Rework / Die Bonder / Flip Chip Equipment - Die Bonder and BGA Rework Equipment

    Manufacturer of BGA rework equipment and flip chip die bonder

    ultrasonic, bga, pitch, tab, paste, opto, soldering, reflow, csp, cob, rework, flip-chip, qfp, ultra-sonic, residual, die-bonder, laser-bar, laser-diode, micro-assembly, solder-removal

    , , , , , , , , , ,

    9 months 3 weeks ago by till linke

  2. BGA Rework / Die Bonder / Flip Chip Equipment - Die Bonder and BGA Rework Equipment

    Manufacturer of BGA rework equipment and flip chip die bonder

    ultrasonic, bga, pitch, tab, paste, opto, soldering, reflow, csp, cob, rework, flip-chip, qfp, ultra-sonic, residual, die-bonder, laser-bar, laser-diode, micro-assembly, solder-removal

    , , , , , , , , , ,

    1 year 7 months ago by ikm